Module identification method for expandable gateway applications

ABSTRACT

A modular wireless communications system (edge device, etc.) that includes a base unit having a base unit processor and one or more additional units that each include a processor, in which the base unit processor is configured with processor-executable software instructions to determine whether the base unit has been combined with the one or more additional units to create a combined unit and/or whether one or more of the additional units have been detached from the combined unit. The processor may automatically perform an edge reconfiguration interrogation and enumeration (ERIE) operation in response to determining that the base unit has been combined with the one or more additional units to create the combined unit or in response to determining that one or more of the additional units have been detached from the combined unit.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. application Ser.No. 17/158,266, filed on Jan. 26, 2021, which claims the benefit ofpriority to U.S. Provisional Application No. 62/968,800, entitled“Module Identification Method for Expandable Gateway Applications” filedJan. 31, 2020, the entire contents of both of which are herebyincorporated by reference for all purposes.

BACKGROUND

Wireless communication technologies have been growing in popularity anduse over the past several years. This growth has been fueled by bettercommunications hardware, larger networks, and more reliable protocols.Wireless and Internet service providers are now able to offer theircustomers with an ever-expanding array of features and services, such asrobust cloud-based services.

To better support these enhancements, more powerful consumer facing edgedevices (e.g., consumer grade access points, IoT gateways, routers,switches, etc.) are beginning to emerge. These devices include morepowerful processors, system-on-chips (SoCs), memories, antennas, poweramplifiers, and other resources (e.g., power rails, etc.) that bettersupport high-speed wireless communications and execute complex and powerintensive applications facilitating edge computing.

In addition to high performance and functionality, consumersincreasingly demand that their devices be affordable, future-proof(e.g., upgradeable, highly versatile, etc.) and small enough to bereadily placed throughout a home or small office.

SUMMARY

A modular wireless communications system that includes a base unithaving a base unit processor and one or more additional units that eachinclude a processor, in which the base unit processor is configured withprocessor-executable software instructions to determine whether the baseunit has been combined with the one or more additional units to create acombined unit, determine whether one or more of the additional unitshave been detached from the combined unit, and perform an edgereconfiguration interrogation and enumeration (ERIE) operation inresponse to determining that the base unit has been combined with theone or more additional units to create the combined unit or in responseto determining that one or more of the additional units have beendetached from the combined unit.

In some aspects, in response to determining that the base unit has beencombined with the one or more additional units to create the combinedunit, or in response to determining that one or more of the additionalunits have been detached from the combined unit, the base unit processoridentifies all of the additional units within the combined unit,verifies the compatibility of all the identified additional units withone another, determines a purpose for each of the identified additionalunits, determines one or more functional capabilities for each of theidentified additional units, and identifies redundancies in the combinedunit based on the determined purposes and determined functionalcapabilities of the identified additional units.

In some aspects, the base unit processor is further configured toeliminate identified redundancies in the combined unit. In some aspects,in response to determining that the base unit has been combined with theone or more additional units to create the combined unit, or in responseto determining that one or more of the additional units have beendetached from the combined unit, the base unit processor determines aphysical stacking order in which the additional units within thecombined unit are combined, determines alternative stacking ordersavailable with the additional units within the combined unit, comparesan efficiency of the physical stacking order to an efficiency of eachalternative stacking order, and sets a logical stacking order based on aresult of the comparison of the efficiency of the physical stackingorder and efficiencies of each alternative stacking order.

In some aspects, in response to determining that the base unit has beencombined with the one or more additional units to create the combinedunit, or in response to determining that one or more of the additionalunits have been detached from the combined unit, the base unit processordetermines whether the maximum number of units has been exceeded,determines power requirements for each unit in the combined unit,determines an overall power budget for the combined unit, determineswhether the power requirements of the units exceed the overall powerbudget of the combined unit, and performs a responsive action inresponse to determine that the power requirements of the units exceedthe overall power budget of the combined unit.

In some aspects, the base unit processor may be configured to performthe responsive action in response to determine that the powerrequirements of the units exceed the overall power budget of thecombined unit by enabling, disabling, powering up, powering down orthrottling one or more of the additional units in the combined unit. Insome aspects, the base unit processor automatically determines theresources, buses, network on chips (NoCs), and communication protocolsfor communicating information between the base unit and each additionalunit in the combined unit in response to determining that the base unithas been combined with the one or more additional units to create thecombined unit, or in response to determining that one or more of theadditional units have been detached from the combined unit. In someaspects, the base unit processor automatically determines an addressingscheme or address structure for the communications between the base unitand each additional unit in the combined unit in response to determiningthat the base unit has been combined with the one or more additionalunits to create the combined unit, or in response to determining thatone or more of the additional units have been detached from the combinedunit. In some aspects, the base unit processor shares resources in adistributed fashion based on functional capabilities of each unit withinthe combined unit.

In some aspects, sharing the resources in the distributed fashionincludes performing CPU sharing operations, performing memory sharingoperations, performing distributed processing operations, performingcommunication system slicing operations, or performing applicationprocess distribution operations. In some aspects, in response todetermining that the base unit has been combined with the one or moreadditional units to create the combined unit, or in response todetermining that one or more of the additional units have been detachedfrom the combined unit, the base unit processor performs operations thatinclude sequentially traversing units in the combined unit to identifyeach unit in the combined unit, determining the order in which the unitsare stacked in the combined unit, determining the relative positions ofeach additional unit with respect to the base unit, and determining theresources, buses, network on chips (NoCs), and communication protocolsthat are used to communicate information between the unit in thecombined unit based on the determined order or relative positions of theunits. In some aspects, determining the resources, buses, NoCs, andcommunication protocols that are used to communicate information betweenthe unit in the combined unit based on the determined order or relativepositions of the units includes assigning higher speed modules (e.g.,PCIe, etc.) to be used by units that are closer to the base unit, andassigning lower speed modules (e.g., SGMII, etc.) to those that arefurther from the base unit.

In some aspects, determining the resources, buses, network NoCs, andcommunication protocols that are used to communicate information betweenthe unit in the combined unit based on the determined order or relativepositions of the units includes assigning available PCIe modules to beused by units that are closer to the base unit, and assigning a serialgigabit media-independent interface (SGMII) to units further from thebase unit after assigning all the available PCIe modules. In someaspects, in response to determining that the base unit has been combinedwith the one or more additional units to create the combined unit, or inresponse to determining that one or more of the additional units havebeen detached from the combined unit, the base unit processor performsoperations that include dynamically switching one or more busses in thecombined unit so that two or more additional unit may use the sameaddresses or the same range of addresses to communicate information.

In some aspects, in response to determining that the base unit has beencombined with the one or more additional units to create the combinedunit, or in response to determining that one or more of the additionalunits have been detached from the combined unit, the base unit processorperforms operations that include sequentially traversing each unit inthe combined unit, reading an electrically erasable programmableread-only memory (EEPROM) on a first traversed unit to determine itsmodule type, setting the general-purpose input/output (GPIO) itsrespective address based on a position of the first traversed unit inthe combined unit so its addresses is function of that unit's positionwithin the stack, using the addresses to establish a link form the firsttraversed unit to the next unit in the combined unit, disconnecting aportion of the GPIO, and repeating the operations above to set the GPIOsor addresses for each subsequently traversed unit until addresses andcommunication links are established between all units in the combinedunit.

In some aspects, in response to determining that the base unit has beencombined with the one or more additional units to create the combinedunit, or in response to determining that one or more of the additionalunits have been detached from the combined unit, the base unit processorperforms operations that include determining or setting a power budgetfor each unit in the combined unit based on the available powerresources, an estimate of the leakage power levels, a relativeimportance or influence of workloads and components in the unit, athermal power envelope, or information included in a look up table.

In some aspects, in response to determining that the base unit has beencombined with the one or more additional units to create the combinedunit, or in response to determining that one or more of the additionalunits have been detached from the combined unit, the base unit processorperforms operations that include balancing tradeoffs between performanceand power consumption on the combined unit so as to ensure that eachunit in the combined unit accomplish its intended functionality withoutthe combined unit exceeding its power budget. In some aspects, inresponse to determining that the base unit has been combined with theone or more additional units to create the combined unit, or in responseto determining that one or more of the additional units have beendetached from the combined unit, the base unit processor performsoperations that include preventing the combined unit form exceeding itspower budget by selectively enabling units in the combined unit based ontheir positions with respect to the base unit, the relative importanceof their functional capabilities to the operation of the combined unit,and its purpose for inclusion in the combined unit.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated herein and constitutepart of this specification, illustrate exemplary aspects of the claims,and together with the general description given above and the detaileddescription given below, serve to explain the features of the claims.

FIGS. 1A and 1B are top and bottom multidimensional views of a modularwireless communications system that includes a base unit that could beconfigured in accordance with some embodiments.

FIGS. 2A and 2B are top and bottom views of the modular wirelesscommunications system illustrated in FIGS. 1A and 1B with the LED/LIDcomponent and/or housing base removed for stacking.

FIG. 3 illustrates a stacked or combined unit that may be configured tooperate as a single unified modular wireless communications system inaccordance with some embodiments.

FIGS. 4A and 4B are component block diagrams illustrating a computingsystem that includes an expandable architecture and a stack connectorthat allows multiple units to be stacked or combined so that theyoperate as a single unified modular wireless communications system inaccordance with some embodiments.

FIGS. 5 and 6 are component block diagrams illustrating examplecomputing and bus architectures that could be used to configure thecomponents in a stacked or combined unit to operate as a single unifiedmodular wireless communications system in accordance with someembodiments.

FIGS. 7A-7C are component block diagrams illustrating example units thatcould be included in a stacked or combined unit in various embodiments.

FIGS. 8-21 are process flow diagrams illustrating methods of operatingan edge device with an expandable architecture in accordance withvarious embodiments.

DETAILED DESCRIPTION

Various aspects will be described in detail with reference to theaccompanying drawings. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.References made to particular examples and implementations are forillustrative purposes, and are not intended to limit the scope of theclaims.

Various different bus and interconnect systems, standards ortechnologies may be included in or used by computing systems configuredin accordance with the various embodiments, including any or all of theperipheral component interconnect (PCI), peripheral componentinterconnect express (PCIe), gigabit media-independent Interface (GMII),media-independent interface (MII), reduced media-independent interface(RMII), reduced gigabit media-independent interface (RGMII), serialgigabit media-independent interface (SGMII), high serial gigabitmedia-independent interface (HSGMII), quad serial gigabitmedia-independent interface (QSGMII), 10 gigabit media-independentinterface (XGMII), System Management Bus (SMBus), and Inter-IntegratedCircuit (I2C). Any references to terminology and/or technical detailsrelated to an individual bus or interconnection standard or technologyare for illustrative purposes only, and not intended to limit the scopeof the claims to a particular system or technology unless specificallyrecited in the claim language.

The various embodiments may include, use, incorporate, implement,provide access to a variety of wired and wireless communicationnetworks, technologies and standards that are currently available orcontemplated in the future, including any or all of Bluetooth®,Bluetooth Low Energy, ZigBee, LoRa, Wireless HART, Weightless P, DASH7,RPMA, RFID, NFC, LwM2M, Adaptive Network Topology (ANT), WorldwideInteroperability for Microwave Access (WiMAX), WIFI, WiFi6, WIFIProtected Access I & II (WPA, WPA2), personal area networks (PAN), localarea networks (LAN), metropolitan area networks (MAN), wide areanetworks (WAN), networks that implement the data over cable serviceinterface specification (DOCSIS), networks that utilize asymmetricdigital subscriber line (ADSL) technologies, third generationpartnership project (3GPP), long term evolution (LTE) systems,LTE-Direct, third generation wireless mobile communication technology(3G), fourth generation wireless mobile communication technology (4G),fifth generation wireless mobile communication technology (5G), globalsystem for mobile communications (GSM), universal mobiletelecommunications system (UMTS), high-speed downlink packet access(HSDPA), 3GSM, general packet radio service (GPRS), code divisionmultiple access (CDMA) systems (e.g., cdmaOne, CDMA2000™), enhanced datarates for GSM evolution (EDGE), advanced mobile phone system (AMPS),digital AMPS (IS-136/TDMA), evolution-data optimized (EV-DO), digitalenhanced cordless telecommunications (DECT), etc. Each of these wiredand wireless technologies involves, for example, the transmission andreception of data, signaling and/or content messages.

Any references to terminology and/or technical details related to anindividual wired or wireless communications standard or technology arefor illustrative purposes only, and not intended to limit the scope ofthe claims to a particular communication system or technology unlessspecifically recited in the claim language.

The term “computing device” may be used herein to refer to any one orall of quantum computing devices, edge devices, Internet accessgateways, modems, routers, network switches, residential gateways,access points, integrated access devices (IAD), mobile convergenceproducts, networking adapters, multiplexers, personal computers, laptopcomputers, tablet computers, user equipment (UE), smailphones, personalor mobile multi-media players, personal data assistants (PDAs), palm-topcomputers, wireless electronic mail receivers, multimedia Internetenabled cellular telephones, gaming systems (e.g., PlayStation™, Xbox™,Nintendo Switch™, etc.), wearable devices (e.g., smartwatch,head-mounted display, fitness tracker, etc.), IoT devices (e.g., smarttelevisions, smart speakers, smart locks, lighting systems, smartswitches, smart plugs, smart doorbells, smart doorbell cameras, smartair pollution/quality monitors, smart smoke alarms, security systems,smart thermostats, etc.), media players (e.g., DVD players, ROKU™,AppleTV™, etc.), digital video recorders (DVRs), and other similardevices that include a programmable processor and communicationscircuitry for providing the functionality described herein.

The term “quantum computing device” may be used herein to refer to acomputing device or edge device, whether it is a standalone device orused in conjunction with current computing processes, that generates ormanipulates quantum bits (qubits) or which utilizes quantum memorystates. A quantum computing device may enhance edge computing capabilityby providing solutions that would be challenging to implement viaconventional computing systems. This is especially true with value addedcomputing for leveraging a diverse amount of sensors and other inputdata to arrive at a solution in real time. Through unifying diverse datasources a quantum computing solution at the edge may accelerate machinelearning, solve complex problems faster as well as provide thefundamental platform for artificial intelligence nodes at the edge ofthe network. With the vast array of data delivered by sensors as wellstate information the quantum computing process may improve the memoryallocation though the use of superposition allowing for more informationto be simultaneously stored and processed.

The term “edge device” may be used herein to refer to a computing devicethat includes a programmable processor and communications circuitry forestablishing communication links to consumer devices (e.g., smartphones,UEs, IoT devices, etc.) and/or to network components in a serviceprovider, core, cloud, or enterprise network. For example, an edgedevice may include or implement functionality associated any one or allof an access point, gateway, modem, router, network switch, residentialgateway, mobile convergence product, networking adapter, customerpremise device, multiplexer and/or other similar devices.

The term “system on chip” (SOC) may be used herein to refer to a singleintegrated circuit (IC) chip that contains multiple resources and/orprocessors integrated on a single substrate. A single SOC may containcircuitry for digital, analog, mixed-signal, and radio-frequencyfunctions. A single SOC may also include any number of general purposeand/or specialized processors (digital signal processors, modemprocessors, video processors, etc.), memory blocks (e.g., ROM, RAM,Flash, etc.), and resources (e.g., timers, voltage regulators,oscillators, etc.). SOCs may also include software for controlling theintegrated resources and processors, as well as for controllingperipheral devices.

The term “system in a package” (SIP) may be used herein to refer to asingle module or package that contains multiple resources, computationalunits, cores and/or processors on two or more IC chips, substrates, orSOCs. For example, a SIP may include a single substrate on whichmultiple IC chips or semiconductor dies are stacked in a verticalconfiguration. Similarly, the SIP may include one or more multi-chipmodules (MCMs) on which multiple ICs or semiconductor dies are packagedinto a unifying substrate. A SIP may also include multiple independentSOCs coupled together via high speed communication circuitry andpackaged in close proximity, such as on a single backplane, singlemotherboard or in a single wireless device. The proximity of the SOCsfacilitates high speed communications and the sharing of memory andresources.

The term “multicore processor” may be used herein to refer to a singleintegrated circuit (IC) chip or chip package that contains two or moreindependent processing cores (e.g., CPU core, IP core, GPU core, etc.)configured to read and execute program instructions. A SOC may includemultiple multicore processors, and each processor in an SOC may bereferred to as a core. The term “multiprocessor” may be used herein torefer to a system or device that includes two or more processing unitsconfigured to read and execute program instructions.

Some embodiments may be configured to perform edge reconfigurationinterrogation and enumeration (ERIE) operations, which may include aninterrogation operation, an enumeration operation, or a reconfigurationoperation.

The term “interrogation operation” is used herein to refer to a set,group or category of operations that allow a device (e.g., based unit,etc.) to detect, through the stack connection using a several busprotocols, the inclusion of additional modules/units that are attachedthrough the stacking mechanism to the base unit. The base unit is ableto detect the inclusion or removal of the additional modules either atbootup or dynamically, hot swap. The base unit is able to determine thata module(s) have been added or removed from the previous historyconfiguration of the combined base unit with stackable modules.

The term “enumeration operation” is used herein to refer to a set, groupor category of operations that provide the ability to identify thetype(s) of modules that are connected to the base unit. An enumerationoperation may also determine the order the modules are stacked relativeto the base unit. The enumeration operations may also be used toidentify or determine whether the modules are stacked in an order thatis correct (or not correct).

The term “reconfiguration operation” is used herein to refer to a set,group or category of operations that enable the units/modules that areconnected, stacked, to the base unit. A reconfiguration operation mayinvolve adjusting the base unit's functionality to incorporate theadditional or removal of stacked unit(s). A reconfiguration operationmay also involve determining the power budget required for each stackedunit and delivering the power as needed from the base unit through thestacking connector along with dynamically adjusting the power level orinstructing the stacked modules to reduce their power consumption.

The embodiments include a modular wireless communications system, suchas an edge device (e.g., Wi-Fi access points, IoT gateways, etc.), thatincludes a baseline feature set and an expandable architecture thatallows end users to add specific features or functionality (e.g.,digital concierge, home assistant, etc.) to the device as needed. Themodular wireless communications system and its components may beconfigured, shaped, formed or arranged so that the customer or user canquickly physically attach additional units (e.g., an auxiliary unit,another base unit, etc.) above, below, or to the sides of a base unit.Once attached, the combined unit (i.e., the base unit and the attachedadditional units) may operate as a single unified device.

The embodiments also include methods for configuring components (e.g.,system buses, processors, resources, etc.) within the individual units(e.g., the base unit, the attached additional units, etc.) so that theymay be combined to operate as a single unified device. For example, oneor more processors in the base unit may be configured so that, when theunits are combined (e.g., when first stacked, upon detecting theaddition or removal of a component or unit to the combined unit, etc.),the processors automatically perform interrogation, enumeration (ordynamic counting scheme), and/or reconfiguration operations. Theprocessors may identify all the components/units within the combinedunit, verify their compatibility with one another, determine the purposeor functional capabilities of each unit, identify and eliminateredundant components/units in the system, determine whether the unitsare stacked or combined properly, determine whether the physical orderin which the units are stacked or combined is efficient (e.g., the mostefficient order, etc.), determine whether the maximum number of unitshas been exceeded, determine power requirements for each unit, determinean overall power budget and whether the power requirements of thecombined units exceed the overall power budget, power up or downindividual units, determine the resources, buses, NoCs, andcommunication protocols that should be used to communicate informationbetween the various components/units in the combined unit, determine anaddressing scheme or structure for the communications, and/or performother similar operations.

As mentioned above, a combined unit may include a base unit and one ormore attached additional units. Each of these units may include,implement or use a variety of different data and control busses,interconnects or standards, including any or all of a peripheralcomponent interconnect (PCI), peripheral component interconnect express(PCIe), gigabit media-independent Interface (GMII), media-independentinterface (MII), reduced media-independent interface (RMII), reducedgigabit media-independent interface (RGMII), serial gigabitmedia-independent interface (SGMII), high serial gigabitmedia-independent interface (HSGMII), quad serial gigabitmedia-independent interface (QSGMII), 10 gigabit media-independentinterface (XGMII), System Management Bus (SMBus), and Inter-IntegratedCircuit (I²C). Each of these resources (e.g., PCIe, SGMII, I²C, etc.)may include different properties or characteristics (e.g., differentbandwidths, communication speeds, different addressing schemes, etc.).In addition, some of these resources only be used by one unit (or only afew units) in the combined stack.

In some embodiments, one or more processors in the base unit may beconfigured so that, when the units are combined or modified, theprocessors automatically traverse the stack or combined unit to identifyeach unit in the stack/combination. The processors may determine theorder in which the units are stacked/combined and/or determine theirrelative positions in the stack/combination with respect to the baseunit. The processors may determine the resources, buses, NoCs, andcommunication protocols that are used to communicate information betweenthe various components/units in the combined unit based on the relativepositions of the units within the stack or combined unit.

That is, to operate efficiently, the higher speed PCIe modules should beused by units that are close to the base unit (e.g., at the bottom ofthe stack or by an additional unit that is stacked immediately above orbelow the base unit, etc.). The other, lower speed, modules should beused closer to top of the stack (e.g., at the top of the stack or by anadditional unit that is stacked atop other additional units attached tothe base unit, etc.). By determining relative positions of the unitswithin the stack or combined unit, the processors may assign higherspeed modules (e.g., PCIe, etc.) to be used by units that are closer tothe base unit and assign lower speed modules (e.g., SGMII, etc.) tothose that are further from the base unit. The processors may alsoactivate or deactivate components within each unit based on the unit'sposition with respect to the base unit.

Some resources, such as I²C interconnects on the control path, have alimited number of addresses or address ranges that could be used forcommunicating data or control information. In some embodiments, thecombined unit may be configured to dynamically switch one or busses inthe system so that two or more components may use the same addresses (orrange of addresses) to communicate information.

For example, the processors may be configured to sequentially traverseeach unit in the combined unit. The processors may read the EEPROM onthe first traversed unit to determine its module type, set the GPIOs ortheir respective addresses (e.g., I²C addresses, etc.) based on theunit's position in stack or combined unit (i.e., so that the addressesare a function of the unit's position within the stack), use theaddresses to establish a link to the next unit in the stack or combinedunit, disconnect a portion of the GPIOs or bus (set it and forget it),and then set the GPIOs or addresses for the next traversed unit. Theprocessor may perform these operations repeatedly until addresses andcommunication links are assigned/established between all the units inthe combined unit.

Generally, the combined unit may be subject to an overall power budget,or a rate or an amount of power that may be consumed by the device overa period of time. In some embodiments, the processors may determine orset the power budget (e.g., in units proportional to Watts, etc.) foreach individual unit and/or for the combined unit based on the availablepower resources, an estimate of the leakage power levels, relativeimportance or influence of workloads and components in the unit, thermalpower envelopes, information included in a look up table, etc.

In some embodiments, the processors may be configured to send a warningto a user and/or select a larger power supply in response to determiningthat that power requirements of the components/units (e.g., powerrequired for the components to operate or accomplish their intendedfunctionality) exceed the overall power budget of the combined unit.

In some embodiments, one or more units in the combined unit may beoperable to decrease energy consumption or thermal energy generation atthe expense of performance or increase performance at the expense ofincreased energy consumption or thermal energy generation. For example,one or more processors in the based unit may throttle (e.g., reduceoperating frequency or periodically pause an operation) or temporarilyreduce power to some of the components within a unit, throttle theprocessing clock frequency of one or more processing components (e.g.,CPU, GPU, etc.), reduce display brightness settings, and/or performother similar operations to ensure that the combined unit does notexceed its power budget, to reduce power consumption, or to dissipateexcess thermal energy.

In some embodiments, the processors may be configured to balancetradeoffs between performance and power consumption on the combined unitso as to ensure that each unit may accomplish its intended functionalitywithout the combined unit exceeding its power budget. That is, while thethrottling operations may reduce power consumption, they may also reducethe performance and/or responsiveness of the unit or the types ofoperations that may be performed by that unit. As such, the processorsmay be configured to selectively enable (or activate, deactivate,power-up, power-off, throttle, etc.) components/units or combinations ofcomponents/units so as to ensure that all enabled components/units mayaccomplish their intended functionality without the combined unitexceeding its power budget. The processors may also selectively enablethe components or units based on their positions with respect to thebase unit, the relative importance of their functional capabilities tothe operation of the combined unit, their purpose for inclusion in thecombined unit, etc. so as to ensure that the combined unit does notexceed its power budget and/or to balance tradeoffs between performanceand power consumption on the device.

In some embodiments, the processors may be configured to perform CPUsharing, distributed processing, and/or application process distributionoperations. That is, the processors may take advantage ofconcurrency/parallelism and/or the multiprocessor resources available inthe combined unit to improve the efficiency and speed of the modularwireless communications system (e.g., reduce power consumption, achievefast response times, high performance, and high user interfaceresponsiveness, etc.). For example, an applications processor in thebase unit may be configured to offload operations to a processor in anauxiliary unit, thereby enabling improvements in processing and/or powerefficiencies. The operations of offloading operations to an auxiliaryunit may include converting or translating portions of a softwareapplication into code that is suitable for execution on the auxiliaryunit, executing different portions of that software application indifferent heterogeneous units or processors at the same time, andcommunicating the results of the execution back to the applicationsprocessor in the base unit. In some embodiments this may be accomplishedby the base unit may analyzing a software application's object code,identifying the operations that are required to be performed duringexecution of the object code, partitioning the object code into objectcode segments based on identified operations, determining whether eachobject code segment may be offloaded and processed in the auxiliaryunit, translating the offload-able object code segments into a formatthat is suitable for execution in the auxiliary unit, and causing theauxiliary unit to execute the translated object code segments inparallel with the non-translated object code segments that executed bythe processor(s) in the base unit.

In some embodiments, the processors may be configured to perform memorysharing operations and/or provide access to a memory that is sharedbetween units (e.g., the base unit and an auxiliary unit, etc.), betweenresources (e.g., a general-purpose applications processor and anauxiliary processor, etc.), or between processes (e.g., a first process(P1) on an applications processor and a second process (P2) on anauxiliary processor, etc.).

FIG. 1A is a multidimensional view from the top of a modular wirelesscommunications system 100 that includes an LED/LID component 102, astackable housing 104 for encapsulating its components (e.g., antenna,heatsink, processors, etc.), and a housing base 106. FIG. 1B is amultidimensional view from the bottom of the modular wirelesscommunications system 100 that illustrates that the housing base 106 mayvarious connector ports 108-112 that may be used to couple thecomponents within the stackable housing 104 to other components.

FIG. 2A is a top view of the modular wireless communications system 100with the LED/LID component 102 removed, and FIG. 2B is a bottom view ofthe modular wireless communications system 100 with the housing base 106removed. FIGS. 2A-B illustrate that the stackable housing 104 mayencapsulate an integrated heatsink and antenna structure 200. Theintegrated heatsink and antenna structure 200 may include may include acavity 204 onto which a processor, computing system, printed circuitboard, integrated circuit (IC) chips, a system on chip (SOC), or systemin a package (SIP) and/or other similar components may be implemented orplaced. In some embodiments, the components/chips may be placed on aheat conducting material that is placed on top of the cavity 204 (oraluminum housing) to help with the heat transfer and to address anyimperfections that arise during manufacturing. In some embodiments,additional components and/or circuitry may be located between theintegrated heatsink and antenna structure 200 and the LED/LID component102, stackable housing 104, and/or housing base 106.

The cavity 204 and/or the components (e.g., IC chips, SOC, SIP, etc.)may include connector ports 108, 206 that provide an interface betweenthe SOC/SIP and other computers or peripheral devices. The connectorports 108, 206 may also allow other computers or peripheral devices tobe physically attached above or below (or to the sides of) a base unit.That is, the stackable housing 104 and connector ports 108, 206 allowmultiple components be stacked on top of, on the side of, or belowanother stackable housing 104, which then allows multiple integratedheatsink and antenna structures (e.g., 200) to be used together in acompact arrangement. Once attached, the combined unit (i.e., the baseunit and the attached additional units) may operate as a single unifieddevice.

FIG. 3 illustrates a combined unit 300 that may be configured to operateas a single unified modular wireless communications system in someembodiments. In the example illustrated in FIG. 3 , the combined unit300 includes an LED/LID component 102, a housing base 106, and threestackable housing 104 a-104 c that each encapsulate various components(e.g., antenna, heatsink, processors, etc.).

FIGS. 4A and 4B illustrates an example computing system 400 that may beincluded in each of the units 104 a-104 c in the combined stack 300 inaccordance with some embodiments. In the example illustrated in FIG. 4A,the computing system 400 includes an SOC 402, a clock 404, and a voltageregulator 406. The SOC 402 may include a digital signal processor (DSP)408, a modem processor 410, a graphics processor 412, an applicationprocessor 414 connected to one or more of the processors, memory 416,custom circuitry 418, system components and resources 420, a thermalmanagement unit 422, and a networks on chip (NOCs) module 424. The SOC402 may operate as central processing unit (CPU) that carries out theinstructions of software application programs by performing thearithmetic, logical, control and input/output (I/O) operations specifiedby the instructions.

The thermal management unit 422 may be configured to monitor and managethe device's junction temperature, surface/skin temperatures and/or theongoing consumption of power by the active components that generatethermal energy in the device. The thermal management unit 422 maydetermine whether to throttle the performance of active processingcomponents (e.g., CPU, GPU, LCD brightness), the processors that shouldbe throttled, the level to which the frequency of the processors shouldbe throttled, when the throttling should occur, etc. The thermalmanagement unit 422 may also determine the power budget and/or powerrequirements of the SOC 402.

The system components and resources 420 and custom circuitry 418 maymanage sensor data, analog-to-digital conversions, wireless datatransmissions, and perform other specialized operations, such asdecoding data packets and processing video signals. For example, thesystem components and resources 420 may include power amplifiers,voltage regulators, oscillators, phase-locked loops, peripheral bridges,temperature sensors (e.g., thermally sensitive resistors, negativetemperature coefficient (NTC) thermistors, resistance temperaturedetectors (RTDs), thermocouples, etc.), semiconductor-based sensors,data controllers, memory controllers, system controllers, access ports,timers, and other similar components used to support the processors andsoftware clients running on a device. The custom circuitry 418 may alsoinclude circuitry to interface with other computing systems andperipheral devices, such as wireless communication devices, externalmemory chips, etc.

Each processor 408, 410, 412, 414 may include one or more cores, andeach processor/core may perform operations independent of the otherprocessors/cores. For example, the SOC 402 may include a processor thatexecutes a first type of operating system (e.g., FreeBSD, LINUX, OS X,macOS, etc.) and a processor that executes a second type of operatingsystem (e.g., ANDROID, IOS, MICROSOFT WINDOWS 10, MICROSOFT SERVER 1903,etc.). In addition, any or all of the processors 408, 410, 412, 414 maybe included as part of a processor cluster architecture (e.g., asynchronous processor cluster architecture, an asynchronous orheterogeneous processor cluster architecture, etc.).

The processors 408, 410, 412, 414 may be interconnected to one anotherand to the memory 418, system components and resources 420, and customcircuitry 418, and the thermal management unit 422 via high-performancenetworks-on chip (NoCs) 424 or an interconnection/bus module. The NoCs424 or interconnection/bus module may include an array of reconfigurablelogic gates and/or implement a bus architecture (e.g., CoreConnect,AMBA, etc.).

The SOC 402 may further include an input/output module (not illustrated)for communicating with resources external to the SOC, such as the clock404 and the voltage regulator 406. Resources external to the SOC (e.g.,clock 604, etc.) may be shared by two or more of the internal SOCprocessors/cores.

In addition to the SOC 402 discussed above, the various embodiments mayinclude or may be implemented in a wide variety of computing systems,which may include a single processor, multiple processors, multicoreprocessors, or any combination thereof.

FIG. 4B illustrates that the computing system 400 may include a type-Cconnector 432 and a stack connector 434, each of which may correspond toand/or may be used in conjunction with the connector ports 108-112 and206 illustrated in FIGS. 1A-2B.

The type-C connector 432 and/or stack connector 434 may include aninterconnection/bus module with various data and control lines forcommunicating with the SOC 402. The type-C connector 432 and/or stackconnector 434 may also expose systems buses and resources of a SOC 402or computing device 400 in a manner that allows the chip or computingsystem to attach to an additional unit to include additional features,functions or capabilities, but which preserves the performance andintegrity of the original SOC 402 or computing device 400. The type-Cconnector 432 and/or stack connector 434 may include proprietary orcustom connector pin-outs that allow for stacking interfaces and/or forthe device to be retrofitted after deployment to expand itscapabilities. This allows the device to have a longer life cycle, andfor the manufacturer to obtain additional revenues from accessory sales,keep the baseline cost of the product down, and sell in a cheaper marketwith the option to upsell later with additional add-on features.

The type-C connector 432 and/or stack connector 434 may include orcontrol various system busses and data/control lines, such as serialgigabit media-independent interface (SGMII), universal serial bus (USB),peripheral component interconnect express (PCIe), general-purposeinput/output (GPIO), etc. The stack connector 434 may also include linksto a dual bidirectional inter-integrated circuit (I²C) bus and SMBusvoltage-level translator (e.g., Level Trans 436) and various loadswitches. Some of these resources may only be used by one unit 104 a-104c in the combined stack 300 at a time, and each of these resources mayinclude different properties or characteristics (e.g., differentbandwidths, communication speeds, etc.).

In addition, the computing system 400 illustrated in FIG. 4B may includeswitches 440, a soft start switch 441, load switches 442, switched modepower supply (SMPS) 444, electrically erasable programmable read onlymemory and (EEPROM) 446, a low power bluetooth or zigbee chip 448, aBluetooth unit 452, an embedded multimedia card (eMMC) 454, a doubledata rate 4 synchronous dynamic random-access memory (DDR4) 456, frontend modules (FEMs) 458, PHYO WLAN RFIC 460, PHY1 WLAN RFIC 462, PHY2WLAN RFIC 464, a FLEX unit 466, and Ethernet PHY XCVR 468.

The switches 440 may be physical switch(s) that used to supply power tothe device from an external power source. The soft start switch 441 maybe software controlled switch configured to activate switching powersupplies. The load switches 442 may configured to provide power tostacking modules or other peripheral using a common power bus (in thiscase 3 VDC and 12 VDC). The SMPS 444 may be switched mode power supplyused to supply power to convert external power source to the requiredvoltage levels needed for the device to operate correctly. The EEPROM446 may store key system parameters. The low power bluetooth or zigbeechip 448 may be radio circuit that provides Zigbee and/or Low Power BT.The Bluetooth unit 452 may be a radio circuit configured to provideBluetooth services.

The eMMC 454 may be configured to put multimedia card (MMC) components,flash memory plus controller, into a small ball grid array (BGA) to bean embedded non-volatile memory system. An eMMC chip may include acontroller and the same NAND flash memory along with a controller thatmanages wear leveling and error correction (ECC). The DDR4 456 may besynchronous dynamic random-access memory (RAM) or the device. The FEMs458 may include the radio frequency (RF) front end for the various radioservices. A FEM 458 may include radio frequency filters, transmit poweramplifier, Low Noise Amplifiers (LNA), a preamp, and other supporting RFcomponents.

PHYO WLAN RFIC 460 may be a physical wireless LAN radio frequencyintegrated circuit used for the delivering upper 5 GHz WiFi service (5.7GHz band). PHY1 WLAN RFIC 462 may be the physical wireless LAN radiofrequency integrated circuit used for the delivering lower 5 GHz WiFiservice (5.2 GHz band). PHY2 WLAN RFIC 464 may be the physical wirelessLAN radio frequency integrated circuit used for the delivering 2.4 GHzWiFi service.

The FLEX unit 466 may be flexible unit that is configured to provideconnectivity from the main C25 unit to dual ethernet connectors, SDcards, etc. The FLEX unit 466 may also include or provide receiver powerfor the C25 unit through a Power over Ethernet (POE) through a lowerstacking unit that facilitates desk, ceiling and wall mounts. EthernetPHY XCVR 468 may be an Ethernet transceiver used for providing theelectrical interface between 402 and ethernet port 0 and 1.

FIGS. 5 and 6 illustrate example computing and communicationarchitectures 500, 600 that could be used to configure the components ina combined unit (e.g., combined unit 300 illustrated in FIG. 3 ) tooperate as a single unified device in accordance with some embodiments.In some embodiments, configuring the components in the combined unit mayinclude identifying and enumerating the components up and down thestack, verifying the compatibility of the components, and/or determiningwhether (or ensuring that) a proper stacking order is maintained, themaximum number of components/units is not exceeded, enough power budgetis available, that there is no duplication of systemfunctionality/modules, etc.

In the examples illustrated in FIGS. 5 and 6 , the computing andcommunication architecture of a modular wireless communications system500 that includes a base unit 502 and additional units 504, 506, 508.Each unit 502-508 is connected to a preceding and/or subsequent unit viaa 40 pin connector (or connector ports 108, 206, etc.). In someembodiments, the modular wireless communications system 500 may be anedge device and/or configured to provide or perform edge computingoperations/functions, which improve the user experience by offloadingcomputation-intensive tasks to edge devices or servers deployed at theedge of the networks, thereby freeing up resources on the computingdevice and/or allowing the computing device to perform more computationsor more resource-intensive tasks. In some embodiments, additional unit508 may be an LED/LID component (e.g., LED/LID component 102 illustratedin FIGS. 1A-3 ) and units 502-506 may be included in stackable housings(e.g., stackable housings 104 a-104 c) illustrated in FIGS. 1A-3 .

In the example illustrated in FIG. 5 , the base unit 502 may include aSMBus voltage-level translator (e.g., Level Trans 436). Additional units504, 506 include a TMUX 510, 520, an I2C Dev0 EEPROM Add 0xA0 512, 522,an I2C Dev1 (8 GPIOs) WrAdd 0x70 514, 524, I2C Dev2 (8 GPIOs) WrAdd 0x72516, 526, and a power grid 518, 528. In the example illustrated in FIG.6 , the base unit 502 includes a USB port 602 and an Inter-IntegratedCircuit (I2C) 604. Additional units 504, 506 include a hub 606, 626,device 608, 628, I2C 610, 630, EEPROM 612, 632, GPIO1 614, 634, andGPIO2 616, 636.

With reference to FIGS. 5 and 6 , the base unit 502 may include abaseline feature set and an expandable architecture that allows endusers to add specific features or functionality (e.g., digitalconcierge, home assistant, etc.) to the device as needed. In someembodiments, the base unit 502 and the one or more additional units504-508 may operate independently and may be combined to operate as asingle unified device 500. In some embodiments, the base unit 502 and/orthe one or more additional units 504-508 may include a processorconfigured so that, when the units are combined (e.g., when firststacked, upon detecting the addition or removal of a component or unitto the combined unit, etc.), the processor(s) automatically performs anedge reconfiguration interrogation and enumeration (ERIE) operation.

The base unit 502 may be configured, shaped, formed or arranged so thatthe customer or user can quickly physically attach additional unitsabove, below, or to the sides of a base unit. Once attached, thecombined unit (i.e., the base unit and the attached additional units)may operate as a single unified device.

Each unit 502-508 may be each be configured so that they operate as asingle unified device when combined. For example, one or more processors(e.g., processors 408-414 illustrated in FIG. 4 , etc.) in the base unit502 may be configured so that, when the units are combined (e.g., whenfirst stacked, upon detecting the addition or removal of a component orunit to the combined unit, etc.), the processors automatically performinterrogation, enumeration (or dynamic counting scheme), and/orreconfiguration operations. The processors may identify all thecomponents/units within the combined unit, verify the compatibility eachunit 502-508 with one another, determine the purpose or functionalcapabilities of each unit 502-508, identify and eliminate redundantcomponents/units 502-508 in the system, determine whether the units502-508 are stacked or combined properly, determine whether the physicalorder in which the units 502-508 are stacked or combined is efficient(e.g., the most efficient order, etc.), determine whether the maximumnumber of units 502-508 has been exceeded, determine power requirementsfor each unit 502-508, determine an overall power budget and whether thepower requirements of the combined units (e.g., units 502 through 508)exceed the overall power budget, power up or down individual units502-508, determine the resources, buses, NoCs, and communicationprotocols that should be used to communicate information between thevarious components/units 502-508 in the combined unit, determine anaddressing scheme or structure for the communications, and/or performother similar operations.

FIGS. 7A-7C illustrate example units that could be included in a stackedor combined unit in various embodiments. For example, FIG. 7Aillustrates that a combined unit may include a base unit 702, aspeaker/microphone auxiliary unit 704, and a 360-degree camera auxiliaryunit 706.

FIG. 7B illustrates that a combined unit may be modified to include thebase unit 702, the speaker/microphone auxiliary unit 704, the 360 degreecamera auxiliary unit 706, a LED/Projector auxiliary unit 708, and adisplay/touchscreen auxiliary unit 710. FIG. 7C illustrates that thecombined unit may be reorganized and further modified to include anHDMI/GPU unit 720 and a cellular unit 722. Each of the units (e.g., baseunit and auxiliary units) may include any or all of the componentsdescribed in this application (e.g., with reference to FIGS. 4A through6 , etc.).

FIG. 8 illustrates a method 800 for operating an edge device (or modularwireless communications system) with an expandable architecture inaccordance with some embodiments. Method 800 may be performed by one ormore processors (e.g., processors 408-414, etc.) in a base unit (e.g.,base unit 502, 702, etc.) or one or more of the additional units (e.g.,units 506-508, etc.) in a combined unit.

In block 802, the processor(s) may monitor sensors or conditions on thedevice to detect certain events or interrupts (e.g., boot event, timerexpiration, etc.). In determination block 804, the processor(s) maydetermine whether the edge device is a combined unit that includes abase unit and one or more additional units. In response to determiningthat the edge device is a combined unit that includes a base unit andone or more additional units (i.e., determination block 804 =“Yes”), indetermination block 806 the processor(s) may determine whether any unitsbeen added or removed from the combined unit since last time aninterrogation, enumeration or reconfiguration operation was performeddue to the device being adjusted, reconfigured or changed.

In response to determining that the edge device is a combined unit thatincludes a base unit and one or more additional units and/or that one ormore units have been added or removed from the combined unit (i.e.,determination blocks 804 and 806==“Yes”), in block 808 the processor(s)may perform edge reconfiguration interrogation and enumeration (ERIE)operations (e.g., at least one or more of an interrogation operation, anenumeration operation, or a reconfiguration operation).

FIG. 9 illustrates a method 900 for operating an edge device (or modularwireless communications system) with an expandable architecture inaccordance with some embodiments. Method 900 may be performed by one ormore processors (e.g., processors 408-414, etc.) in a base unit (e.g.,base unit 502, 702, etc.) or one or more of the additional units (e.g.,units 506-508, etc.) in a combined unit.

In block 902, the processor(s) may determine whether the base unit hasbeen combined with the one or more additional units to create a combinedunit. In block 904, the processor(s) may determine whether one or moreof the additional units have been detached from the combined unit. Inblock 906, the processor(s) may perform an ERIE operation in response todetermining that the base unit has been combined with the one or moreadditional units to create the combined unit or in response todetermining that one or more of the additional units have been detachedfrom the combined unit.

FIG. 10 illustrates a method 1000 for operating an edge device (ormodular wireless communications system) with an expandable architecturein accordance with some embodiments. Method 1000 may be performed by oneor more processors (e.g., processors 408-414, etc.) in a base unit(e.g., base unit 502, 702, etc.) or one or more of the additional units(e.g., units 506-508, etc.) in a combined unit.

With reference to FIG. 10 , in block 1002 the processor(s) may determinethat the base unit has been combined with the one or more additionalunits to create a combined unit (e.g., as part of block 902, etc.) orthat one or more of the additional units have been detached from thecombined unit (e.g., as part of block 904, etc.). In response, in block1004, the processor(s) may identify all of the additional units withinthe combined unit. In block 1006, the processor(s) may verify thecompatibility of all the identified additional units with one another.In block 1004, the processor(s) may determine a purpose for each of theidentified additional units. In block 1004, the processor(s) maydetermine one or more functional capabilities for each of the identifiedadditional units. In block 1004, the processor(s) may identifyredundancies in the combined unit based on the determined purposes anddetermined functional capabilities of the identified additional units.In block 1004, the processor(s) may eliminate identified redundancies inthe combined unit.

FIGS. 11-21 illustrate methods 1100-2100 for operating an edge device(or modular wireless communications system) with an expandablearchitecture in accordance with some embodiments. Methods 1100-2100 maybe performed by one or more processors (e.g., processors 408-414, etc.)in a base unit (e.g., base unit 502, 702, etc.) or one or more of theadditional units (e.g., units 506-508, etc.) in a combined unit. In eachof methods 1100-2100, in block 1002 the processor(s) may determine thatthe base unit has been combined with the one or more additional units tocreate a combined unit or that one or more of the additional units havebeen detached from the combined unit.

With reference to FIG. 11 , in block 1104, the processor(s) maydetermine a physical stacking order in which the additional units withinthe combined unit are combined. In block 1106, the processor(s) maydetermine alternative stacking orders available with the additionalunits within the combined unit. In block 1108, the processor(s) maycompare an efficiency of the physical stacking order to an efficiency ofeach alternative stacking order. In block 1110, the processor(s) may seta logical stacking order based on a result of the comparison of theefficiency of the physical stacking order and efficiencies of eachalternative stacking order.

With reference to FIG. 12 , in block 1204, the processor(s) maydetermine whether the maximum number of units has been exceeded (i.e.,in response to determining in block 1002 that base unit has beencombined with the one or more additional units, etc.). In block 1206,the processor(s) may determine power requirements for each unit in thecombined unit. In block 1208, the processor(s) may determine an overallpower budget for the combined unit. In block 1210, the processor(s) maydetermine whether the power requirements of the units exceed the overallpower budget of the combined unit. In block 1212, the processor(s) mayperform a responsive action (e.g., enable, disable, power up, power downor throttle one or more of the additional units in the combined unit,etc.) in response to determine that the power requirements of the unitsexceed the overall power budget of the combined unit.

With reference to FIG. 13 , in block 1304, the processor(s) maysequentially traverse units in the combined unit to identify each unitin the combined unit. In block 1306, the processor(s) may determine theorder in which the units are stacked in the combined unit. In block1308, the processor(s) may determine the relative positions of eachadditional unit with respect to the base unit. In block 1310, theprocessor(s) may determine the resources, buses, network on chips(NoCs), and communication protocols that are used to communicateinformation between the unit in the combined unit based on thedetermined order or relative positions of the units.

With reference to FIG. 14 , in block 1404, the processor(s) maysequentially traverse each unit in the combined unit. In block 1406, theprocessor(s) may read an electrically erasable programmable read-onlymemory (EEPROM) on a first traversed unit to determine its module type.In block 1408, the processor(s) may set the general-purpose input/output(GPIO) its respective address based on a position of the first traversedunit in the combined unit so its addresses is function of that unit'sposition within the stack. In block 1410, the processor(s) may use theaddresses to establish a link form the first traversed unit to the nextunit in the combined unit. In block 1412, the processor(s) maydisconnect a portion of the GPIO. In block 1414, the processor(s) mayrepeat the above operations to set the GPIOs or addresses for eachsubsequently traversed unit in the combined until addresses andcommunication links are established between all units in the combinedunit.

With reference to FIG. 15 , in block 1504, the processor(s) maydetermine or set a power budget for each unit in the combined unit basedon the available power resources, an estimate of the leakage powerlevels, a relative importance or influence of workloads and componentsin the unit, a thermal power envelope, and/or information included in alook up table in response to determining (e.g., in block 1002) that thebase unit has been combined with the one or more additional units tocreate a combined unit or that one or more of the additional units havebeen detached from the combined unit.

With reference to FIG. 16 , in block 1604, the processor(s) may preventthe combined unit form exceeding its power budget by selectivelyenabling units in the combined unit based on their positions withrespect to the base unit, the relative importance of their functionalcapabilities to the operation of the combined unit, and its purpose forinclusion in the combined unit. The operations in block 1604 may beperformed in response to determining (e.g., in block 1002) that the baseunit has been combined with the one or more additional units to create acombined unit or that one or more of the additional units have beendetached from the combined unit.

With reference to FIG. 17 , in block 1704, the processor(s) maydynamically switch one or more busses in the combined unit so that twoor more additional units in the combined unit may communicateinformation via the same addresses or via the same range of addresses inresponse to determining (e.g., in block 1002) that the base unit hasbeen combined with the one or more additional units to create a combinedunit or that one or more of the additional units have been detached fromthe combined unit.

With reference to FIG. 18 , in block 1804, the processor(s) may balancetradeoffs between performance and power consumption on the combined unitso as to ensure that each unit in the combined unit accomplish itsintended functionality without the combined unit exceeding its powerbudget. The operations in block 1804 may be performed in response todetermining (e.g., in block 1002) that the base unit has been combinedwith the one or more additional units to create a combined unit or thatone or more of the additional units have been detached from the combinedunit.

With reference to FIG. 19 , in block 1904, the processor(s) mayautomatically determine the resources, buses, network on chips (NoCs),and communication protocols for communicating information between thebase unit and each additional unit in the combined unit. The operationsin block 1904 may be performed in response to determining (e.g., inblock 1002) that the base unit has been combined with the one or moreadditional units to create a combined unit or that one or more of theadditional units have been detached from the combined unit.

With reference to FIG. 20 , in block 2004, the processor(s) mayautomatically determine an addressing scheme or address structure forthe communications between the base unit and each additional unit in thecombined unit. The operations in block 2004 may be performed in responseto determining (e.g., in block 1002) that the base unit has beencombined with the one or more additional units to create a combined unitor that one or more of the additional units have been detached from thecombined unit.

With reference to FIG. 21 , in block 2104, the processor(s) may shareresources in a distributed fashion (e.g., by performing CPU sharingoperations, memory sharing operations, distributed processingoperations, communication system slicing operations, application processdistribution operations, etc.) based on functional capabilities of eachunit within the combined unit. The operations in block 2104 may beperformed in response to determining (e.g., in block 1002) that the baseunit has been combined with the one or more additional units to create acombined unit or that one or more of the additional units have beendetached from the combined unit.

Some embodiments may include a method of operating an edge device withan expandable architecture, which may include determining, by aprocessor in the edge device, whether a base unit in the edge device hasbeen combined with one or more additional units to create a combinedunit, determining, by the processor, whether one or more of theadditional units have been detached from the combined unit, andperforming, by the processor, an ERIE operation in response todetermining that the base unit in the edge device has been combined withthe one or more additional units to create the combined unit or inresponse to determining that one or more of the additional units havebeen detached from the combined unit.

In some embodiments the method may include identifying all of theadditional units within the combined unit, verifying the compatibilityof all the identified additional units with one another, determining apurpose for each of the identified additional units, determining one ormore functional capabilities for each of the identified additionalunits, and identifying redundancies in the combined unit based on thedetermined purposes and determined functional capabilities of theidentified additional units in response to determining that the baseunit has been combined with the one or more additional units to createthe combined unit, or in response to determining that one or more of theadditional units have been detached from the combined unit.

In some embodiments, the method may further include eliminatingidentified redundancies in the combined unit.

In some embodiments, the method may include determining a physicalstacking order in which the additional units within the combined unitare combined, determining alternative stacking orders available with theadditional units within the combined unit, comparing an efficiency ofthe physical stacking order to an efficiency of each alternativestacking order, and setting a logical stacking order based on a resultof the comparison of the efficiency of the physical stacking order andefficiencies of each alternative stacking order in response todetermining that the base unit has been combined with the one or moreadditional units to create the combined unit, or in response todetermining that one or more of the additional units have been detachedfrom the combined unit.

In some embodiments, the method may include determining whether themaximum number of units has been exceeded, determining powerrequirements for each unit in the combined unit, determining an overallpower budget for the combined unit, determining whether the powerrequirements of the units exceed the overall power budget of thecombined unit, and performing a responsive action in response todetermine that the power requirements of the units exceed the overallpower budget of the combined unit in response to determining that thebase unit has been combined with the one or more additional units tocreate the combined unit, or in response to determining that one or moreof the additional units have been detached from the combined unit.

In some embodiments, the method may include performing the responsiveaction in response to determine that the power requirements of the unitsexceed the overall power budget of the combined unit includes performingthe responsive action in response to determining that the powerrequirements of the units exceed the overall power budget of thecombined unit by enabling, disabling, powering up, powering down orthrottling one or more of the additional units in the combined unit.

In some embodiments, the method may include automatically determiningthe resources, buses, network on chips (NoCs), and communicationprotocols for communicating information between the base unit and eachadditional unit in the combined unit in response to determining that thebase unit has been combined with the one or more additional units tocreate the combined unit, or in response to determining that one or moreof the additional units have been detached from the combined unit.

In some embodiments, the method may include automatically determining anaddressing scheme or address structure for the communications betweenthe base unit and each additional unit in the combined unit in responseto determining that the base unit has been combined with the one or moreadditional units to create the combined unit, or in response todetermining that one or more of the additional units have been detachedfrom the combined unit.

In some embodiments, the method may include sharing resources in adistributed fashion based on functional capabilities of each unit withinthe combined unit. In some embodiments, sharing the resources in thedistributed fashion may include performing CPU sharing operations,performing memory sharing operations, performing distributed processingoperations, performing communication system slicing operations, orperforming application process distribution operations.

In some embodiments, the method may include sequentially traversingunits in the combined unit to identify each unit in the combined unit,determining the order in which the units are stacked in the combinedunit, determining the relative positions of each additional unit withrespect to the base unit, and determining the resources, buses, networkon chips (NoCs), and communication protocols that are used tocommunicate information between the unit in the combined unit based onthe determined order or relative positions of the units in response todetermining that the base unit has been combined with the one or moreadditional units to create the combined unit, or in response todetermining that one or more of the additional units have been detachedfrom the combined unit.

In some embodiments, determining the resources, buses, NoCs, andcommunication protocols that are used to communicate information betweenthe unit in the combined unit based on the determined order or relativepositions of the units may include assigning higher speed modules (e.g.,PCIe, etc.) to be used by units that are closer to the base unit, andassigning lower speed modules (e.g., SGMII, etc.) to those that arefurther from the base unit.

In some embodiments, determining the resources, buses, network NoCs, andcommunication protocols that are used to communicate information betweenthe unit in the combined unit based on the determined order or relativepositions of the units may include assigning available PCIe modules tobe used by units that are closer to the base unit, and assigning aserial gigabit media-independent interface (SGMII) to units further fromthe base unit after assigning all the available PCIe modules.

In some embodiments, the method may include dynamically switching one ormore busses in the combined unit so that two or more additional unit mayuse the same addresses or the same range of addresses to communicateinformation in response to determining that the base unit has beencombined with the one or more additional units to create the combinedunit, or in response to determining that one or more of the additionalunits have been detached from the combined unit.

In some embodiments, the method may include sequentially traversing eachunit in the combined unit, reading an electrically erasable programmableread-only memory (EEPROM) on a first traversed unit to determine itsmodule type, setting the general-purpose input/output (GPIO) itsrespective address based on a position of the first traversed unit inthe combined unit so its addresses is a function of that unit's positionwithin the stack, using the addresses to establish a link form the firsttraversed unit to the next unit in the combined unit, disconnecting aportion of the GPIO, and repeating the operations above to set the GPIOsor addresses for each subsequently traversed unit until addresses andcommunication links are established between all units in the combinedunit in response to determining that the base unit has been combinedwith the one or more additional units to create the combined unit, or inresponse to determining that one or more of the additional units havebeen detached from the combined unit.

In some embodiments, the method may include determining or setting apower budget for each unit in the combined unit based on the availablepower resources, an estimate of the leakage power levels, a relativeimportance or influence of workloads and components in the unit, athermal power envelope, or information included in a look up table inresponse to determining that the base unit has been combined with theone or more additional units to create the combined unit, or in responseto determining that one or more of the additional units have beendetached from the combined unit.

In some embodiments, the method may include balancing tradeoffs betweenperformance and power consumption on the combined unit so as to ensurethat each unit in the combined unit accomplish its intendedfunctionality without the combined unit exceeding its power budget inresponse to determining that the base unit has been combined with theone or more additional units to create the combined unit, or in responseto determining that one or more of the additional units have beendetached from the combined unit.

In some embodiments, the method may include preventing the combined unitform exceeding its power budget by selectively enabling units in thecombined unit based on their positions with respect to the base unit,the relative importance of their functional capabilities to theoperation of the combined unit, and its purpose for inclusion in thecombined unit in response to determining that the base unit has beencombined with the one or more additional units to create the combinedunit or in response to determining that one or more of the additionalunits have been detached from the combined unit.

Some embodiments may include a modular wireless communications system(edge device, etc.) that includes a baseline feature set and anexpandable architecture that allows end users to add specific featuresor functionality (e.g., digital concierge, home assistant, etc.) to thedevice as needed. In some embodiments, the modular wirelesscommunications system may include a base unit and one or more additionalunits.

In some embodiments, the base unit and the one or more additional unitsmay operate independently and may be combined to operate as a singleunified device. In some embodiments, the base unit and/or the one ormore additional units may include a processor configured so that, whenthe units are combined (e.g., when first stacked, upon detecting theaddition or removal of a component or unit to the combined unit, etc.),the processor(s) automatically performs an edge reconfigurationinterrogation and enumeration (ERIE) operation.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include identifying all the components/units within the combinedunit, verifying the compatibility of all the components/units with oneanother, determining the purpose or functional capabilities of each unitin the combined unit, identifying and eliminating redundantcomponents/units in the combined unit, determining whether all the unitsin the combined unit are stacked or combined properly, determiningwhether the physical order in which the units are stacked or combined isefficient (e.g., the most efficient order, etc.), determining whetherthe maximum number of units has been exceeded, determining powerrequirements for each unit in the combined unit, determining an overallpower budget for the combined unit, determining whether the powerrequirements of the units exceed the overall power budget of thecombined unit, enabling, disabling, powering up, powering down orthrottling individual units in the combined unit, determining theresources, buses, NoCs, and communication protocols that should be usedto communicate information between the unit in the combined unit, ordetermining an addressing scheme or address structure for thecommunications between the units.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include sharing resources in a distributed fashion in response todetermining the purpose or functional capabilities of each unit in thecombined unit.

In some embodiments, sharing the resources in the distributed fashion inresponse to determining the purpose or functional capabilities of eachunit in the combined unit comprises at least one of performing CPUsharing operations, performing memory sharing operations, performingdistributed processing operations, performing communication systemslicing operations, or performing application process distributionoperations.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include determining that the units have be combined or that thecombined unit has been modified, sequentially traversing the units inthe stacked or combined unit to identify each unit in the combined unit,determining the order in which the units are stacked/combined in thecombined unit or determining their relative positions in thestack/combination with respect to the base unit, and determining theresources, buses, NoCs, and communication protocols that are used tocommunicate information between the unit in the combined unit based onthe order or relative positions of the units.

In some embodiments, determining the resources, buses, NoCs, andcommunication protocols that are used to communicate information betweenthe unit in the combined unit based on the order or relative positionsof the units comprises assigning higher speed modules (e.g., PCIe, etc.)to be used by units that are closer to the base unit, and assigninglower speed modules (e.g., SGMII, etc.) to those that are further fromthe base unit.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include dynamically switching one or busses in the combined unit sothat two or more components/unit may use the same addresses (or range ofaddresses) to communicate information.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include sequentially traversing each unit in the combined unit,reading the EEPROM on the first traversed unit to determine its moduletype, setting the GPIOs or their respective addresses (e.g., I²Caddresses, etc.) based on the unit's position in the combined unit(i.e., so that the addresses are a function of the unit's positionwithin the stack), using the addresses to establish a link to the nextunit in the combined unit, disconnecting a portion of the GPIOs or bus(set it and forget it), and repeating the operations above to set theGPIOs or addresses for each subsequently traversed unit until addressesand communication links are assigned/established between all the unitsin the combined unit.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include determining or setting a power budget (e.g., in unitsproportional to Watts, etc.) for each individual unit and/or for thecombined unit based on the available power resources, an estimate of theleakage power levels, relative importance or influence of workloads andcomponents in the unit, thermal power envelopes, or information includedin a look up table.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include sending a warning to a user and/or selecting a larger powersupply in response to determining that that power requirements of thecomponents/units (e.g., power required for the components to operate oraccomplish their intended functionality) exceed the power budget of thecombined unit.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include throttling or temporarily reducing power to a unit (or tosome of the components within a unit) or throttle the processing clockfrequency of one or more processing components to ensure that thecombined unit does not exceed the power budget.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include balancing tradeoffs between performance and powerconsumption on the combined unit so as to ensure that each unit mayaccomplish its intended functionality without the combined unitexceeding the power budget.

In some embodiments, the base unit and/or the one or more additionalunits may include a processor configured so that, when the units arecombined to form a combined unit, the processor(s) perform operationsthat include selectively enabling the units in the combined unit basedon their positions with respect to the base unit, the relativeimportance of their functional capabilities to the operation of thecombined unit, their purpose for inclusion in the combined unit so as toensure that the combined unit does not exceed its power budget.

The processors or processing units described in this application (e.g.,the processors 408-414 of the modular wireless communications system,etc.) may be any programmable microprocessor, microcomputer or multipleprocessor chip or chips that can be configured by software instructions(applications) to perform a variety of functions, including thefunctions of the various aspects described in this application. In somewireless devices, multiple processors may be provided, such as oneprocessor dedicated to wireless communication functions and oneprocessor dedicated to running other applications. Typically, softwareapplications may be stored in the internal memory before they areaccessed and loaded into the processor. The processor may includeinternal memory sufficient to store the application softwareinstructions.

A number of different types of memories and memory technologies areavailable or contemplated in the future, any or all of which may beincluded and used in systems and computing devices that implement thevarious embodiments. Such memory technologies/types may includenon-volatile random-access memories (NVRAM) such as Magnetoresistive RAM(M-RAM), resistive random access memory (ReRAM or RRAM), phase-changerandom-access memory (PC-RAM, PRAM or PCM), ferroelectric RAM (F-RAM),spin-transfer torque magnetoresistive random-access memory (STT-MRAM),and three-dimensional cross point (3D-XPOINT) memory. Such memorytechnologies/types may also include non-volatile or read-only memory(ROM) technologies, such as programmable read-only memory (PROM), fieldprogrammable read-only memory (FPROM), one-time programmablenon-volatile memory (OTP NVM). Such memory technologies/types mayfurther include volatile random-access memory (RAM) technologies, suchas dynamic random-access memory (DRAM), double data rate (DDR)synchronous dynamic random-access memory (DDR SDRAM), staticrandom-access memory (SRAM), and pseudostatic random-access memory(PSRAM). Systems and computing devices that implement the variousembodiments may also include or use electronic (solid-state)non-volatile computer storage mediums, such as FLASH memory. Each of theabove-mentioned memory technologies include, for example, elementssuitable for storing instructions, programs, control signals, and/ordata for use in or by a computer or other digital electronic device. Anyreferences to terminology and/or technical details related to anindividual type of memory, interface, standard or memory technology arefor illustrative purposes only, and not intended to limit the scope ofthe claims to a particular memory system or technology unlessspecifically recited in the claim language.

As used in this application, the terms “component,” “module,” “system,”and the like may refer to a computer-related entity, such as, but notlimited to, hardware, firmware, a combination of hardware and software,software, or software in execution, which are configured to performparticular operations or functions. For example, a component may be, butis not limited to, a process running on a processor, a processor, anobject, an executable, a thread of execution, a program, and/or acomputer. By way of illustration, both an application running on awireless device and the wireless device may be referred to as acomponent. One or more components may reside within a process and/orthread of execution and a component may be localized on one processor orcore and/or distributed between two or more processors or cores. Inaddition, these components may execute from various non-transitorycomputer readable media having various instructions and/or datastructures stored thereon. Components may communicate by way of localand/or remote processes, function or procedure calls, electronicsignals, data packets, memory read/writes, and other known network,computer, processor, and/or process related communication methodologies.

As used in this application, the term “runtime system” may refer to acombination of software and/or hardware resources in a computing device(e.g., the modular wireless communications system, etc.) that supportthe execution of an application program in that device. For example, aruntime system may include all or portions of the computing device'sprocessing resources, operating systems, library modules, schedulers,processes, threads, stacks, counters, and/or other similar components. Aruntime system may be responsible for allocating computational resourcesto an application program, for controlling the allocated resources, andfor performing the operations of the application program.

In some embodiments, the modular wireless communications system mayinclude a parallel programming runtime system. A parallel programmingruntime system is a runtime system that supports concurrent/parallelexecution of all or portions of one or more application programs. Modernparallel programming runtime systems allow software designers to createhigh-performance parallel application programs that better exploit theconcurrency and/or parallelism capabilities of modern processorarchitectures. A software designer may specify the portions of anapplication program that are to be executed (such as aprogrammer-specified C/C++ function) by the parallel programming runtimesystem. The runtime system may execute or perform the portions in one ormore hardware processing units (e.g., a processor or processing core,such as the applications processor 414 of the modular wirelesscommunications system, etc.) via processes, threads, or tasks.

In some embodiments, the modular wireless communications system (or itsprocessors) may be configured to execute processes. A process may be asoftware representation of an application program in the computingdevice. Processes may be executed on a processor in short time slices sothat it appears that multiple application programs are runningsimultaneously on the same processor (e.g., by using time-divisionmultiplexing techniques), such as a single-core processor. When aprocess is removed from a processor at the end of a time slice,information pertaining to the current operating state of the process(i.e., the process's operational state data) is stored in memory so theprocess may seamlessly resume its operations when it returns toexecution on the processor. A process's operational state data mayinclude the process's address space, stack space, virtual address space,register set image (e.g. program counter, stack pointer, instructionregister, program status word, etc.), accounting information,permissions, access restrictions, and state information. The stateinformation may identify whether the process is in a running state, aready or ready-to-run state, or a blocked state. A process is in theready-to-run state when all of its dependencies or prerequisites forexecution have been met (e.g., memory and resources are available,etc.), and is waiting to be assigned to the next available processingunit. A process is in the running state when its procedure is beingexecuted by a processing unit. A process is in the blocked state when itis waiting for the occurrence of an event (e.g., input/output completionevent, etc.).

A process may spawn other processes, and the spawned process (i.e., achild process) may inherit some of the permissions and accessrestrictions (i.e., context) of the spawning process (i.e., the parentprocess). A process may also be a heavy-weight process that includesmultiple lightweight processes or threads, which are processes thatshare all or portions of their context (e.g., address space, stack,permissions and/or access restrictions, etc.) with otherprocesses/threads. Thus, a single process may include multiple threadsthat share, have access to, and/or operate within a single context(e.g., a processor, process, or application program's context).

The modular wireless communications system may be multiprocessor systemthat is configured to execute multiple threads concurrently or inparallel to improve a process's overall execution time. In addition, anapplication program, operating system, runtime system, scheduler, oranother component in the modular wireless communications system may beconfigured to create, destroy, maintain, manage, schedule, or executethreads based on a variety of factors or considerations. For example, toimprove parallelism, the modular wireless communications system may beconfigured to create a thread for every sequence of operations thatcould be performed concurrently with another sequence of operations.

Generally, application programs that maintain a large number of idlethreads, or frequently destroy and create new threads, may have asignificant negative or user-perceivable impact on the responsiveness,performance, or power consumption characteristics of the modularwireless communications system. Therefore, in some embodiments, anapplication program may implement or use a task-parallel programmingmodel or solution that provides adequate levels of parallelism withoutrequiring the creation or maintenance of a large number of threads. Suchsolutions allow the modular wireless communications system to split thecomputation of an application program into tasks, assign the tasks tothe thread pool that maintains a near-constant number of threads (e.g.,one for each processing unit), and execute assigned tasks via thethreads of the thread pool.

A task may include any procedure, unit of work, or sequence ofoperations that may be executed in a processing unit via a thread. Atask may include state information that identifies whether the task islaunched, ready, blocked, or finished. A task is in the launched statewhen it has been assigned to a thread pool and is waiting for apredecessor task to finish execution and/or for other dependencies orprerequisites for execution to be met. A task is in the ready state whenall of its dependencies or prerequisites for execution have been met(e.g., all of its predecessors have finished execution), and is waitingto be assigned to the next available thread. A task is in the blockedstate when it (or its associated thread) is waiting on a dependency tobe resolved, a resource to become available, a system call to return, aresponse to system request, etc. A task may be marked as finished afterits procedure has been executed by a thread or after being canceled.

A process scheduler or runtime system of the modular wirelesscommunications system may schedule tasks for execution on the processingunits, similar to how processes and threads may be scheduled forexecution. The parallel programming runtime system of the modularwireless communications system may execute or perform a portion of anapplication program by launching or executing tasks. During execution,each task may invoke system calls to request information from an entitythat is external to, or outside the scope of, the application program orthe runtime system.

Various aspects illustrated and described are provided merely asexamples to illustrate various features of the claims. However, featuresshown and described with respect to any given aspect are not necessarilylimited to the associated aspect and may be used or combined with otheraspects that are shown and described. Further, the claims are notintended to be limited by any one example aspect. For example, one ormore of the operations of the methods may be substituted for or combinedwith one or more operations of the methods.

The foregoing method descriptions and the process flow diagrams areprovided merely as illustrative examples and are not intended to requireor imply that the operations of various aspects must be performed in theorder presented. As will be appreciated by one of skill in the art theorder of operations in the foregoing aspects may be performed in anyorder. Words such as “thereafter,” “then,” “next,” etc. are not intendedto limit the order of the operations; these words are used to guide thereader through the description of the methods. Further, any reference toclaim elements in the singular, for example, using the articles “a,”“an,” or “the” is not to be construed as limiting the element to thesingular.

Various illustrative logical blocks, modules, components, circuits, andalgorithm operations described in connection with the aspects disclosedherein may be implemented as electronic hardware, computer software, orcombinations of both. To clearly illustrate this interchangeability ofhardware and software, various illustrative components, blocks, modules,circuits, and operations have been described above generally in terms oftheir functionality. Whether such functionality is implemented ashardware or software depends upon the particular application and designconstraints imposed on the overall system. Skilled artisans mayimplement the described functionality in varying ways for eachparticular application, but such aspect decisions should not beinterpreted as causing a departure from the scope of the claims.

The hardware used to implement various illustrative logics, logicalblocks, modules, and circuits described in connection with the aspectsdisclosed herein may be implemented or performed with a general purposeprocessor, a digital signal processor (DSP), an application specificintegrated circuit (ASIC), a field programmable gate array (FPGA) orother programmable logic device, discrete gate or transistor logic,discrete hardware components, or any combination thereof designed toperform the functions described herein. A general-purpose processor maybe a microprocessor, but, in the alternative, the processor may be anyconventional processor, controller, microcontroller, or state machine. Aprocessor may also be implemented as a combination of receiver smartobjects, e.g., a combination of a DSP and a microprocessor, a pluralityof microprocessors, one or more microprocessors in conjunction with aDSP core, or any other such configuration. Alternatively, someoperations or methods may be performed by circuitry that is specific toa given function.

In one or more aspects, the functions described may be implemented inhardware, software, firmware, or any combination thereof. If implementedin software, the functions may be stored as one or more instructions orcode on a non-transitory computer-readable storage medium ornon-transitory processor-readable storage medium. The operations of amethod or algorithm disclosed herein may be embodied in aprocessor-executable software module or processor-executableinstructions, which may reside on a non-transitory computer-readable orprocessor-readable storage medium. Non-transitory computer-readable orprocessor-readable storage media may be any storage media that may beaccessed by a computer or a processor. By way of example but notlimitation, such non-transitory computer-readable or processor-readablestorage media may include RAM, ROM, EEPROM, FLASH memory, CD-ROM orother optical disk storage, magnetic disk storage or other magneticstorage smart objects, or any other medium that may be used to storedesired program code in the form of instructions or data structures andthat may be accessed by a computer. Disk and disc, as used herein,includes compact disc (CD), laser disc, optical disc, digital versatiledisc (DVD), floppy disk, and Blu-ray disc where disks usually reproducedata magnetically, while discs reproduce data optically with lasers.Combinations of the above are also included within the scope ofnon-transitory computer-readable and processor-readable media.Additionally, the operations of a method or algorithm may reside as oneor any combination or set of codes and/or instructions on anon-transitory processor-readable storage medium and/orcomputer-readable storage medium, which may be incorporated into acomputer program product.

The preceding description of the disclosed aspects is provided to enableany person skilled in the art to make or use the claims. Variousmodifications to these aspects will be readily apparent to those skilledin the art, and the generic principles defined herein may be applied toother aspects without departing from the scope of the claims. Thus, thepresent disclosure is not intended to be limited to the aspects shownherein but is to be accorded the widest scope consistent with thefollowing claims and the principles and novel features disclosed herein.

What is claimed is:
 1. A modular wireless communications system,comprising: a base unit comprising a base unit processor; and one ormore additional units that each comprise a processor, wherein the baseunit processor is configured with processor-executable softwareinstructions to: determine whether the base unit has been combined withthe one or more additional units to create a combined unit; determinewhether one or more of the additional units have been detached from thecombined unit; identify the one or more additional units that arecurrently included in the combined unit in response to determining thebase unit has been combined with the one or more additional units tocreate the combined unit or in response to determining that at least oneof the one or more of the additional units have been detached from thecombined unit; determine a purpose for each of the identified additionalunits; determine one or more functional capabilities for each of theidentified additional units; identify redundancies in the combined unitbased on the determined purposes and determined functional capabilitiesof the identified additional units; and eliminate identifiedredundancies in the combined unit.
 2. The modular wirelesscommunications system of claim 1, wherein the base unit processor isfurther configured to verify the compatibility of all the identifiedadditional units with one another.
 3. The modular wirelesscommunications system of claim 1, wherein the base unit processor isfurther configured to determine whether the maximum number of units hasbeen exceeded in response to determining the base unit has been combinedwith the one or more additional units.
 4. The modular wirelesscommunications system of claim 1, wherein the base unit processor isfurther configured to determine power requirements for each of theidentified additional units.
 5. The modular wireless communicationssystem of claim 4, wherein the base unit processor is further configuredto determine an overall power budget for the combined unit.
 6. Themodular wireless communications system of claim 5, wherein the base unitprocessor is further configured to determine whether the powerrequirements of the units exceed the overall power budget of thecombined unit.
 7. The modular wireless communications system of claim 6,wherein the base unit processor is further configured to perform aresponsive action in response to determine that the power requirementsof the units exceed the overall power budget of the combined unit. 8.The modular wireless communications system of claim 7, wherein the baseunit processor is further configured to perform the responsive actionby: enabling one or more of identified additional units; disabling oneor more of identified additional units; powering up one or more ofidentified additional units; power down one or more of identifiedadditional units; or throttling one or more of the identified additionalunits.
 9. The modular wireless communications system of claim 1, whereinin response to determining that the base unit has been combined with theone or more additional units to create the combined unit, or in responseto determining that one or more of the additional units have beendetached from the combined unit, the base unit processor performsoperations that include: sequentially traversing each unit in thecombined unit; reading an electrically erasable programmable read-onlymemory (EEPROM) on a first traversed unit to determine its module type;setting the general-purpose input/output (GPIO) its respective addressbased on a position of the first traversed unit in the combined unit soits addresses is function of that unit's position within the stack;using the addresses to establish a link form the first traversed unit tothe next unit in the combined unit; disconnecting a portion of the GPIO;and repeating the operations above to set the GPIOs or addresses foreach subsequently traversed unit until addresses and communication linksare established between all units in the combined unit.
 10. The modularwireless communications system of claim 1, wherein in response todetermining that the base unit has been combined with the one or moreadditional units to create the combined unit, or in response todetermining that one or more of the additional units have been detachedfrom the combined unit, the base unit processor performs operations thatinclude: sequentially traversing units in the combined unit to identifyeach unit in the combined unit; determining the order in which the unitsare stacked in the combined unit; determining the relative positions ofeach additional unit with respect to the base unit; and determining theresources, buses, network on chips (NoCs), and communication protocolsthat are used to communicate information between the unit in thecombined unit based on the determined order or relative positions of theunits.
 11. A method of operating an edge device with an expandablearchitecture, comprising: determining, by a processor in the edgedevice, whether the base unit has been combined with the one or moreadditional units to create a combined unit; determining, by theprocessor, whether one or more of the additional units have beendetached from the combined unit; identifying, by the processor, the oneor more additional units that are currently included in the combinedunit in response to determining the base unit has been combined with theone or more additional units to create the combined unit or in responseto determining that at least one of the one or more of the additionalunits have been detached from the combined unit; determining, by theprocessor, a purpose for each of the identified additional units;determining, by the processor, one or more functional capabilities foreach of the identified additional units; identifying, by the processor,redundancies in the combined unit based on the determined purposes anddetermined functional capabilities of the identified additional units;and eliminating, by the processor, identified redundancies in thecombined unit.
 12. The method of claim 11, wherein the base unitprocessor is further configured to verify the compatibility of all theidentified additional units with one another.
 13. The method of claim11, wherein the base unit processor is further configured to determinewhether the maximum number of units has been exceeded in response todetermining the base unit has been combined with the one or moreadditional units.
 14. The method of claim 11, wherein the base unitprocessor is further configured to determine power requirements for eachof the identified additional units.
 15. The method of claim 14, whereinthe base unit processor is further configured to determine an overallpower budget for the combined unit.
 16. The method of claim 15, whereinthe base unit processor is further configured to determine whether thepower requirements of the units exceed the overall power budget of thecombined unit.
 17. The method of claim 16, wherein the base unitprocessor is further configured to perform a responsive action inresponse to determine that the power requirements of the units exceedthe overall power budget of the combined unit.
 18. The method of claim17, wherein the base unit processor is further configured to perform theresponsive action by: enabling one or more of identified additionalunits; disabling one or more of identified additional units; powering upone or more of identified additional units; power down one or more ofidentified additional units; or throttling one or more of the identifiedadditional units.
 19. The method of claim 11, wherein in response todetermining that the base unit has been combined with the one or moreadditional units to create the combined unit, or in response todetermining that one or more of the additional units have been detachedfrom the combined unit, the base unit processor performs operations thatinclude: sequentially traversing each unit in the combined unit; readingan electrically erasable programmable read-only memory (EEPROM) on afirst traversed unit to determine its module type; setting thegeneral-purpose input/output (GPIO) its respective address based on aposition of the first traversed unit in the combined unit so itsaddresses is function of that unit's position within the stack; usingthe addresses to establish a link form the first traversed unit to thenext unit in the combined unit; disconnecting a portion of the GPIO; andrepeating the operations above to set the GPIOs or addresses for eachsubsequently traversed unit until addresses and communication links areestablished between all units in the combined unit.
 20. The method ofclaim 11, wherein in response to determining that the base unit has beencombined with the one or more additional units to create the combinedunit, or in response to determining that one or more of the additionalunits have been detached from the combined unit, the base unit processorperforms operations that include: sequentially traversing units in thecombined unit to identify each unit in the combined unit; determiningthe order in which the units are stacked in the combined unit;determining the relative positions of each additional unit with respectto the base unit; and determining the resources, buses, network on chips(NoCs), and communication protocols that are used to communicateinformation between the unit in the combined unit based on thedetermined order or relative positions of the units.